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About the project
WP1 Project Management T1.1 Overall project coordination T1.2 Operational project management T1.3 Quality & innovation management, risk assessment T1.4 Research Data Management
WP2 Requirements T2.1 Definition of the requirements of the photonics technologies T2.2 Definition of the requirements of the photonics circuits T2.3 Definition of the requirements of the photonics applications T2.4 Sustainability improvement of the silicon photonics value chain
WP3 Photonics Technologies T3.1 SiPho Technology Development T3.2 Photonics substrates technology development T3.3 Integration of non-silicon materials at wafer level
WP4 Photonics Circuits T4.1 PIC100 circuits design T4.2 Path Finding to PIC200 circuits design T4.3 Photonics Tools T4.4 Photonics Packaging & Assembly T4.5 EIC Circuits Development
WP5 Photonics Applications T5.1 Demonstrators for Datacom & Hyperscaler T5.2 Demonstrators for AI Accelerator T5.3 Demonstrators for sensing T5.4 Telecom Demonstrator
WP6 Exploitation & Dissemination T6.1 External communication and dissemination of the results T6.2 Exploitation of STARLight results and business plans. T6.3 Education and Training
WP3 Photonics Technologies

The Work Package 3 (WP3) is dedicated to developing the foundational Photonics Technologies which are at the core of the PIC100 & PIC200 platforms that the STARLight consortium partners will use to develop PICs and application-focus demonstrators. These technologies include the Photonics Substrates and foundry processes as well as the integration schemes which will be the technology components needed by the WP4 and WP5.

The objectives of the Work Package 3 are:
  • O3.1: Developing and maturing an industrial 300mm Silicon Photonics platform (PIC100) as well as develop pathfinding process solutions for the next gen technology (PIC200)
  • O3.2: Developing and productizing SOI photonics substrates pilot line to reach PIC100 and PIC 200 specifications.
  • O3.3: Exploring new materials and/or substrates (such as LNOI or BTO) to enable next gen capabilities for the photonics platform.
  • O3.4: Paving the way for heterogeneous integration on PIC100 & PIC200 for high-speed and high-efficiency modulation applications.