Research highlights

about workshop
ePIXfab is organizing a new Cross-Fertilization Workshop on High-Speed Optical Modulators, bringing together several European research projects working on related photonic technologies.

Cross-fertilization workshops are a recurring format organized by ePIXfab to connect researchers, engineers, and industry partners working on complementary aspects in photonics. These events bring together a specialized audience, enabling in-depth technical discussions that broaden perspectives on the technology and its potential applications while also fostering new collaborations between European partners. Previous editions have focused on topics such as Heterogeneous Integration and Applications in Quantum Photonics.

 

This presentation delves into the cutting-edge advancements in silicon photonics, which are pivotal for addressing the escalating requirements for high-speed, energy-efficient interconnects. We will discuss the state-of-the-art technologies based on SOI and SiN platforms, along with heterogeneous and 3D integration strategies that tackle the challenges presented by generative AI and high-performance computing applications. The talk will elucidate how these innovations are revolutionizing optical interconnects and laying the groundwork for future developments in high-bandwidth, low-latency communication systems. Attendees will gain insights into the latest research and development efforts aimed at CEA-Leti for enhancing computational performance and reducing energy consumption in next-generation interconnect solutions.

As Silicon Photonics is growing to a mainstay, key-enabling technology for general-purpose datacenters and AI factories networking, hyperscalers and application providers keep asking for more. In this talk, we will provide a brief, comprehensive overview of ST vision and ambitions for Silicon Photonics optical transceivers and co-packaged optics (CPO) technologies, aiming at strengthening the industrial maturity and performance of 100Gbaud/lane SiPho solutions – notably leveraging 300-mm process, high yields, and advanced packaging – as well as providing the market with continuous innovations, including TSV enablement and roadmaps to welcome future optical techs such as integrating heterogeneous materials for 200+Gbaud/lane transceiver implementations.