Research highlights

 

Optics and photonics have been integrated into technologies for defense and security for decades. For reasons of size, weight and power consumption, and potentially performance, PICs could in principle be an excellent candidate to enable the next generation of such technologies, impacting, e.g., communications, radar and lidar, and all kinds of sensors and countermeasures in electronic warfare. In this Panel we will discuss the clear opportunities, but also assess the current obstacles that prevent PIC technology entering the field of defense and security.

Explore the balance between flexibility and cost across multiple PIC application areas, highlighted by a panel discussion on scaling the quantum photonics pilot line. Speakers from imecNL, QuiX Quantum, Xanadu

This presentation explores the transformative role of co-packaged optics with integrated silicon photonics in accelerating large-scale AI development. These technological innovations significantly enhance energy efficiency and scalability for AI applications by reducing electrical loss, improving resilience, and optimizing network performance within data center architectures. Strong industry collaboration and ecosystem partnerships are essential to continue advancing these technologies, enabling high-density, high-bandwidth connectivity for robust AI networking.

As Silicon Photonics is growing to a mainstay, key-enabling technology for general-purpose datacenters and AI factories networking, hyperscalers and application providers keep asking for more. In this talk, we will provide a brief, comprehensive overview of ST vision and ambitions for Silicon Photonics optical transceivers and co-packaged optics (CPO) technologies, aiming at strengthening the industrial maturity and performance of 100Gbaud/lane SiPho solutions – notably leveraging 300-mm process, high yields, and advanced packaging – as well as providing the market with continuous innovations, including TSV enablement and roadmaps to welcome future optical techs such as integrating heterogeneous materials for 200+Gbaud/lane transceiver implementations.

This presentation delves into the cutting-edge advancements in silicon photonics, which are pivotal for addressing the escalating requirements for high-speed, energy-efficient interconnects. We will discuss the state-of-the-art technologies based on SOI and SiN platforms, along with heterogeneous and 3D integration strategies that tackle the challenges presented by generative AI and high-performance computing applications. The talk will elucidate how these innovations are revolutionizing optical interconnects and laying the groundwork for future developments in high-bandwidth, low-latency communication systems. Attendees will gain insights into the latest research and development efforts aimed at CEA-Leti for enhancing computational performance and reducing energy consumption in next-generation interconnect solutions.

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