The PIC100 technologies developed in WP3 and WP4 will provide solutions for the next generation of devices used for optical communications in data centers and in free space. In T5.1, we will showcase the use of the PIC100 technology and, particularly the 100 GBd PIC (from T4.1.1), the engine-level assembly processes (from T4.4.1), a 100 GBd compact modulator (from T4.2.2), for 100 GBd data communications, over optical fibers (T5.1.1, T5.1.3 and T5.1.4) or in free space (T5.1.2) with a focus on reliability and technological achievement beyond the state-of-the-art of actual approaches. The sub-tasks T5.1.2 and T5.1.3 will use the PIC200 technology from WP3.1.2 and demonstrate 400 Gb/s per lane data speed with a high number of optical fibers and a power reduction per bit.