In an era defined by the rapid evolution of global semiconductor technologies, forging a highly resilient and mutually prosperous international chip ecosystem has become a global imperative. Rising to this strategic vision, the National Institutes of Applied Research (NIAR), under the auspices of Taiwan's National Science and Technology Council (NSTC), partnered with the world-leading nanoelectronics R&D hub, imec, to proudly host the "2026 Taiwan-Europe Chip Innovation Forum" (TECIF 2026) in Antwerp, Belgium, on September 9-10, 2026. Under the overarching theme of "Bridging Silicon, Synergizing the Future," this premier forum convened over 300 distinguished leaders, experts, and scholars from the industrial, governmental, academic, and research vanguard of both regions. The forum stands as a pivotal platform not only for aligning future technological blueprints between Taiwan and Europe but also for pioneering forward-looking chip technologies and establishing robust, transnational frameworks for semiconductor talent cultivation.
The opening ceremony was marked by a stellar lineup of prominent leaders who delivered visionary remarks. The distinguished roster included Minister Cheng-Wen Wu of the NSTC, Representative Jhy-Wey Shieh of the Taipei Representative Office in the EU and Belgium, President Hung-Yin Tsai of NIAR, and Vice President Philippe Absil of imec, who collectively inaugurated this monumental semiconductor event.
In his opening address, NSTC Minister Cheng-Wen Wu emphasized that the massive demands of the modern semiconductor industry transcend the capabilities of any single nation. Bound by shared core values of innovation and trust, Taiwan and Europe stand as indispensable global partners. Taiwan is eager to synergize its top-tier manufacturing capabilities with Europe's profound scientific heritage and R&D capacity. Through the TECIF platform, both regions will continuously deepen their collaboration in cutting-edge frontiers–such as advanced packaging and silicon photonics–while accelerating two-way talent mobility to fortify global supply chain resilience. Minister Wu stressed that the next wave of human innovation, spanning AI, quantum computing, and space exploration, will be fundamentally anchored in semiconductors. Taiwan remains steadfast in its commitment to leveraging its ICT and manufacturing prowess to complement European ingenuity, jointly revitalizing advanced manufacturing and engineering a sustainable, prosperous future for all humanity.
Representative Jhy-Wey Shieh of the Taipei Representative Office in the EU and Belgium offered a profound perspective, noting that in the realm of nanotechnology, "the smaller, the greater." Though Taiwan and Belgium may be geographically compact, both command a pivotal and transformative influence on the global stage. He highlighted that Taiwan, having historically benefited from the support of the international community, now stands as a key global player armed with robust semiconductor capabilities, possessing both the capacity and the unwavering resolve to contribute to global progress. In a creative stroke of rhetoric, Representative Shieh reinterpreted the NSTC acronym as "Never Stops Taking Care," powerfully illustrating Taiwan's steadfast dedication to bridging the world through its celebrated semiconductor achievements and uniting with international partners to drive meaningful technological advancement, even amidst global uncertainties.
President Hung-Yin Tsai of NIAR articulated that while visionary policies chart the course, their ultimate realization demands robust research capabilities and relentless investment in cutting-edge infrastructure. As the architect of this forum and Taiwan's premier national research institute, NIAR is wholly dedicated to providing world-class research platforms and shoulders the critical mission of nurturing the next generation of technological trailblazers. He stressed that beyond the exploration of revolutionary technologies like silicon photonics, smart sensing, and advanced packaging, "talent" remains the absolute bedrock of industrial sustainability. Confronting the global scarcity of elite semiconductor professionals, President Tsai envisions seamlessly merging Taiwan's unparalleled strengths in hands-on semiconductor education and pragmatic research with the profound academic legacy of Europe's top-tier institutions, thereby unlocking unprecedented opportunities for cross-border learning and exchange. He reaffirmed that NIAR, alongside its affiliated Taiwan Semiconductor Research Institute (TSRI), has long served as the vital bridge between academia and industry. TECIF 2026 boldly extends this bridge across continents, forging an enduring partnership between Taiwan and Europe to catalyze profound and substantive future collaborations.
The forum featured captivating keynote addresses from industry titans, including imec Vice President Philippe Absil and United Microelectronics Corporation (UMC) Vice President Wen-Chi Ting. Furthermore, the event showcased two meticulously curated high-level panel discussions–"Taiwan-Europe Dialogue I: Strategy and Vision" and "Taiwan-Europe Dialogue II: Action and Implementation." These panels brought together elite representatives from the European Commission's Directorate-General for Communications Networks, Content and Technology (DG Connect), imec, the Taiwan Chip-based Industrial Innovation Program (TCIIP) Office, and multinational corporations to directly tackle current industry bottlenecks and explore strategic solutions for global talent mobility.