Ever-increasing computing power is required by artificial intelligence, in particular to train algorithms. As a result, AI companies increase the number of graphics processing units (GPUs) to train and run their models, to the point of simultaneously using multiple racks, structures that each contain numerous GPUs.
However, this type of configuration requires the capacity to interconnect the GPUs so that high-speed data transmission is ensured. "Traditional copper connections are now at their limit in terms of data rates, reach, bandwidth density and energy efficiency," remarks Yannick Paillard, Chief Commercial Officer at Scintil Photonics.
A complete solution with lasers integrated on a single silicon photonic chip
For more efficient GPU interconnections, the start-up Scintil Photonics enables a different means of data transport with its multi-wavelengths light source. The company, founded in 2018 by Sylvie Menezo, then head of the Integrated Photonics Laboratory at CEA-Leti, specializes in silicon photonics applied to optical connectivity.
More specifically, Scintil Photonics developed SHIP (Scintil Heterogeneous Integrated Photonics) technology, which is the result of research conducted at CEA-Leti. "Integrating different optical functions into a silicon chip is nothing new. What sets us apart is our ability to add lasers into a silicon photonic chip using a technique developed at CEA-Leti," explains Yannick Paillard. "Furthermore, we collaborated with an industrial partner, Tower Semiconductor, to develop a method of producing these chips, that integrates all these photonic elements on a large scale and at a competitive cost."
Therefore, the Scintil Photonics technology enables significantly higher throughput rates per optical fiber. While copper connections are limited to 200 Gb/s, our DWDM light source, built using SHIP technology, enables speeds of up to 800 Gb/s per fiber and beyond.
"CEA is proud to have been behind the creation of Scintil Photonics and delighted to support them in their development of next-generation solutions. The SHIP technology they developed is a major breakthrough for high-speed interconnections in data centers. Their photonic chips with integrated laser sources, which can be mass-produced and significantly reduce energy consumption, are perfectly adapted to the AI requirements of data centers. Our extensive expertise in direct molecular bonding and our 100 mm to 300 mm photonic platforms will allow us to continue to support innovation and technological excellence," adds Eléonore Hardy, Manager of silicon photonics partnerships at CEA-Leti.